| 摘要 |
PROBLEM TO BE SOLVED: To improve wiring pattern adhesive force and solder wettability by adding a specific quantity of a glass component having a softening point higher than the contracting temperature of a substrate and lower than the peak temperature of baking to a metal powder composed mainly of silver. SOLUTION: A glass frit, having a softening point higher than the contraction starting temperature in the unbaked state of a substrate 1 consisting of Ag metal powder and a dielectric porcelain layer laminated thereon and lower than the peak temperature of baking, is added at a ratio of 3.0-12.0 pts.wt. to 100 wt.% of the metal component to form a conductive paste. A surface wiring pattern 2 is formed on the substrate 1 by the use of this conductive paste and baked integrally with the substrate 1. At this time, the glass is precipitated in the interface between the surface of the substrate 1 and the wiring pattern 2, to improve and keep the initial state of the surface wiring pattern and the adhesive strength after leaving it at a high temperature by anchor effect, and the diffusion to the substrate 1 is also suppressed to prevent the deterioration of high frequency characteristic and keep the solder wettability of the wiring pattern 2. |
