| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for mounting which is improved in soldered connection reliability, and in addition, in moisture reliability by constituting the device in a completely hermetically sealed structure. SOLUTION: In this conductor device, in which a semiconductor element 3 provided with metallic pillar bodies or bumps for outside connection on an electrode forming surface is sealed with a resin, a half-cured thermosetting resin layer or a resin film layer 8 formed at a temperature of 100 deg.C or higher is formed on the electrode forming surface, on which the metallic pillar bodies or bumps 6 are formed with a thickness larger than the heights of the metallic pillar bodies or bumps 6. |
