摘要 |
A method for manufacturing a metal interconnection includes the steps of, preparing an active matrix provided with a substrate, an insulating layer and an opening formed through the insulating layer, forming a diffusion barrier layer on surfaces of the opening and the insulating layer, forming a protection layer on the diffusion barrier layer, forming a first metal layer into the opening and upon the protection layer, forming a second metal layer on the first metal layer, and polishing back the first and the second metal layer to a top surface of the insulating layer, thereby forming a metal interconnection.
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