发明名称 |
LIQUID COOLING TYPE COOLING BODY |
摘要 |
PROBLEM TO BE SOLVED: To downsize a whole cooling device capable of cooling a larger number of heating elements by one liquid cooling type cooling body with its cooling liquid made to flow through inside. SOLUTION: The cooling body contacting with the heating element is formed in a rectangular solid and four peripheries surrounding an axis connecting both end side surfaces of the rectangular solid body contact the heating element. The cooling liquid spirally flowing in the flowing-through path of the cooling liquid provided in the vicinity of the periphery of the cooling body cools the heating element by contacting it to the four peripheries of the rectangular cooling body. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2004363417(A) |
申请公布日期 |
2004.12.24 |
申请号 |
JP20030161563 |
申请日期 |
2003.06.06 |
申请人 |
FUJI ELECTRIC HOLDINGS CO LTD |
发明人 |
MOCHIDA TOSHIHARU;KAIDA HIDETOSHI;TABATA TAKEAKI |
分类号 |
H05K7/20;H01L23/473;(IPC1-7):H01L23/473 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|