| 摘要 |
PROBLEM TO BE SOLVED: To provide a mount substrate for flip-chip mounting which is suppressed in an increase of area by increasing a contact area between an electrode pad thereof and a bump, and also to provide a semiconductor device. SOLUTION: Chip electrode pads 6 of a semiconductor chip 5 are face-down-bonded to substrate electrode pads 8 of the mount substrate 2 of a two-layer structure consisting of an upper-layer substrate 3 and a lower-layer substrate 4 via bumps 7. In a substrate electrode pad 8 region of the upper-layer substrate 3 of the mount substrate 2, a plurality of holes 9 are formed, with an Au film 11 formed on side faces of these holes 9. When the semiconductor chip 5 having the bumps 7 formed on the chip electrode pads 6 is mounted on the mount substrate 2, the bumps 7 are squashed to enter the holes 9 of the mount substrate 2, resulting in an increase of contact area between the bumps 7 and the substrate electrode pads 8 of the mount substrate 2. COPYRIGHT: (C)2005,JPO&NCIPI
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