发明名称 SOLDERING MATERIAL STRUCTURE
摘要 FIELD: soldering processes and devices, namely materials for coating surface of drilling bit characterized by wear resistance and high strength. ^ SUBSTANCE: soldering material is in the form of rod having separate members rigidly joined one to other. Several members include composite of broken particles of hard alloy in solder used as binder for said particles; other members include solder alloy. Said members are arranged alternatively. ^ EFFECT: enhanced efficiency of drilling bit, simplified process for restoring it. ^ 3 dwg, 1 tbl, 4 ex
申请公布号 RU2256541(C1) 申请公布日期 2005.07.20
申请号 RU20030131258 申请日期 2003.10.23
申请人 发明人 TIKHONOV O.V.
分类号 B23K35/02;B23K35/14;B23K35/40;B23K37/00 主分类号 B23K35/02
代理机构 代理人
主权项
地址