| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductive resin composition which can form a semiconductive layer capable of preventing electrification without damaging electronic components and capable of keeping resin properties such as heat resistance, and to provide a wiring circuit board comprising a semiconductive layer formed by using the semiconductive resin composition. <P>SOLUTION: An imide resin or an imide resin precursor, a conductive polymer, and a metal salt of a sulfonated polybenzoxazole compound are mixed in a solvent to prepare the semiconductive resin composition in which these components are dissolved. The semiconductive resin composition is applied to a surface of a cover layer 5 including a terminal part 6 and to a surface of a metal-supporting layer 2 exposed from the cover layer 5 and a base layer 3 in a suspension substrate 1 with a circuit, dried, heated, and washed with water to form a semiconductive layer 10. Then, the wiring circuit board is obtained by removing the semiconductive layer 10 formed on the terminal part 6 and the surface of the metal-supporting layer 2 exposed from the cover layer 5 and the base layer 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
