| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board A and an electrode connection structure B of circuit excellent in connection reliability in which a sufficiently low connection resistance is attained and stabilized connection of electrode is ensured, even if the electrode pitch becomes narrow due to minute structure. SOLUTION: In the circuit board A, a conductive bump 20 is provided on the electrode surface of a circuit board 10 on which an electrode 11 is provided wherein the conductive bump 20 uses synthetic resin as a nucleus 21, and its surface is covered with a thin conductive metal layer 22 having a melting point of 250°C or below and structured in a molten metal bonding 30 to the electrode surface. In the electrode connection structure B, the surface of the electrode 11 on the circuit board A and the surface of the electrode 41 on other circuit board 40 are arranged oppositely, the conductive bump 20 using synthetic resin as a nucleus 21 and having a surface covered with a thin conductive metal layer 22 having a melting point of 250°C or below is provided between the opposing electrode surfaces. The conductive bump 20 is processed in the molten metal bonding 30 to the electrode surface under a state pressed slightly flatly, and no conductive fine particle exist in the space between respective electrodes. COPYRIGHT: (C)2007,JPO&INPIT
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