METHOD FOR PACKAGING LED DEVICES ON METAL SUBSTRATE, AND METAL SUBSTRATE COMPRISING LED DEVICES

摘要

A method for mounting an LED(Light Emitting Device) device and a metal substrate and the metal substrate for mounting the LED device are provided to improve the mounting density of a light source by encapsulating an upper surface of the LED device with a transparent material. A concave section is prepared on a flat metal substrate or metal substrate(c). An LED(d) is mounted on the metal substrate. A wiring circuit(f) is formed on an insulating plate(g). The insulating plate is attached on a surface of the metal substrate. A frame(e) for a resin encapsulation is arranged on the insulating plate. A portion for mounting the LED has one or more shapes out of a circle, an ellipse, a polygon, and a groove. A resin section and a metal section on a wall of the concave section are used as a reflective plate to reflect a light emitted from the LED.