发明名称 GAS SUPPLY MECHANISM AND SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the leakage of treatment gas through a gap even when the gap is generated between members caused by the thermal expansion of a treatment gas supplying mechanism formed by laminating a plurality of members. SOLUTION: A treatment gas supplying hole 211 is constituted of a gas discharging port 214 provided on an electrode plate 206 and a gas injection port 212 provided on the treatment gas supplying mechanism main body 201 while the gas injection port generates a suction force in a suction flow passage 236 formed around a nozzle unit utilizing ejector effect by injecting the treatment gas, flowed into upstream side, from the injection port 232a of the nozzle unit 232 provided at the downstream side of the treatment gas against the gas discharging port. According to this operation, leakage of treatment gas into the boundary between the treatment gas supplying mechanism main body 201 and the electrode plate 206 can be prevented. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009004713(A) 申请公布日期 2009.01.08
申请号 JP20070166863 申请日期 2007.06.25
申请人 TOKYO ELECTRON LTD 发明人 IIZUKA YASHIRO
分类号 H01L21/3065;C23C16/455 主分类号 H01L21/3065
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