| 摘要 |
PROBLEM TO BE SOLVED: To provide an intermediate chip for connection for forming electrical connection between semiconductor chips and a semiconductor device, a circuit board and an electronic appliance provided with the intermediate chip for the connection as a technology for making rearrangement wiring possible in a three-dimensional chip lamination technology without adversely affecting the manufacturing process of the semiconductor chip. SOLUTION: The intermediate chip 1 for the connection for forming the electrical connection between the semiconductor chips comprises a substrate 2, a through electrode 3 projected on the surface side of at least one of the front and back surfaces of the substrate 2, a post electrode 4 arranged at a position different from the through electrode 3 in the plane view on the other surface side of the substrate 2, and a wiring part 5 arranged in the substrate 2 or on the surface of the substrate 2 for conducting the through electrode 3 and the post electrode 4. COPYRIGHT: (C)2005,JPO&NCIPI |
