| 摘要 |
An electrode pattern and a wire bonding method are provided to form a wire for wire bonding on a thin and long electrode pattern. An electrode pattern(103) for wire bonding has long and short sides, a wire bond reference pattern to represent a reference position to determine a position of the wire bond, and a wire bond recognition pattern(107), and satisfies the following: L>=14.3x(W-3d/4), Lb<=14.3x(W-3d/4) where L is a distance between the reference position and a line which is parallel to the short side and which passes across a position on a metal portion for wire bonding attached to the electrode pattern, where a width in the parallel direction to the short side is maximum, Lb is a distance between a line which passes through a center of the wire bond recognition pattern in the long side direction and which is parallel to the short side, and a position on the metal portion where a width parallel to the short side is maximum, d is a maximum width of the metal portion for wire bonding attached to the electrode pattern, which is parallel to the short side, and W is a width in the parallel direction to the short side of the electrode pattern. |
