| 摘要 |
Disclosed is a photosensitive resin composition having good plating resistance, sensitivity, developability and adhesive force. Also disclosed are a photosensitive film, a method for forming a pattern using the photosensitive film, and a printed board. The photosensitive resin composition is characterized by containing a binder, a polymerizable compound, a photopolymerization initiator, an inorganic filler and an adhesion accelerator. The photosensitive film is characterized in that it is obtained by arranging a photosensitive layer, which is composed of the photosensitive resin composition, on a supporting body. The method for forming a pattern is characterized by comprising at least a step wherein the photosensitive layer of the photosensitive film is exposed to light. The printed board is characterized by having a permanent pattern formed by the pattern forming method. |
