| 摘要 |
The present invention relates to a selective plating device. According to the present invention, the selective plating device comprises: a plating tank wherein a plating solution flows thereinto and is discharged therefrom; a jig unit installed to position a longitudinal direction of metal to be plated in a horizontal direction, arranged on an upper portion of the plating tank, and provided with an upper electrode to partially deposit the metal to be plated in the plating solution; and a lower electrode installed in the plating tank in a direction facing a lower surface of the metal to be plated, and provided with at least one spray unit to spray the plating solution upwards to form an upward flow. Accordingly, the metal to be plated including the lower surface and side surfaces is partially deposited to plate only a deposited portion of the metal to be plated. Bubbles created on the lower surface of the metal to be plated when plating can be removed to plate the lower surface of the metal to be plated. The metal to be plated can be plated with a uniform thickness by a flow of the plating solution formed around the metal to be plated by an upward flow and a lateral flow. A level of the plating solution can be uniformly maintained by interference of the lateral flow with the upward flow to accurately and selectively plate only a portion of the metal to be plated without using an additional masking member or the like. |
