| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that comprises heat radiation plates on both sides, and to provide a technology for preventing peel-off between the heat radiation plates and a package.SOLUTION: A semiconductor device 2 comprises a transistor 12, a package 3 with which the transistor 12 is molded, a first heat radiation plate 4 and a second heat radiation plate 5. The first heat radiation plate 4 is bonded with a first lateral face 3a of the package 3, and fixed to one surface of the transistor 12 in the package 3. The second heat radiation plate 5 is bonded with a second lateral face 3b provided at an opposite side to the first lateral face 3a, of the package 3 so as to be opposed to the first heat radiation plate 4, and fixed to the transistor 12 in the package 3. A plurality of grooves 9 are provided in a high stress region provided on a bonding surface with the package 3 of the first heat radiation plate 4 and where a tensile stress of a predetermined value or more is generated.SELECTED DRAWING: Figure 3 |
