发明名称 Thermal conductivity measuring device and method of measuring the thermal conductivity
摘要 The inventive concept relates to a thermal conductivity measuring device and a method of measuring the thermal conductivity. The thermal conductivity measuring device may include a first structure which is connected to one side end of a sample and receives heat from a heat source; a second structure connected to the other side end of the sample; a first stage connected to the first structure while supporting the first structure; a second stage connected to the second structure while supporting the second structure; a connection unit connected between the first stage and the second stage; and a measuring unit measuring temperatures of the first and second structures and the first and second stages. Since the thermal conductivity measuring of the inventive concept correct a temperature change of a stage due to heat transmission emitted from the stage considering a measurement environment, reliability of measurement may be improved.
申请公布号 US9377421(B2) 申请公布日期 2016.06.28
申请号 US201514862678 申请日期 2015.09.23
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 Hyun Younghoon;Park Young Sam;Jang Moon Gyu;Zyung Taehyoung
分类号 G01N25/00;G01K1/00;G01N25/18 主分类号 G01N25/00
代理机构 Rabin & Berdo, P.C. 代理人 Rabin & Berdo, P.C.
主权项 1. A thermal conductivity measuring method comprising: providing heat to a first structure connected to one side end of a sample; measuring temperatures of the first structure and a second structure connected to the other side end of the sample; measuring temperatures of a first stage supporting the first structure and a second stage supporting the second structure; and calculating thermal conductivity of the sample using the amount of heat provided to the first structure and the measured temperatures of the first structure, the second structure, the first stage and the second stage.
地址 Daejeon KR