| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for bonding a semiconductor capable of keeping excellent solder bonding properties even after a prolonged storage, by suppressing transition of components between a semiconductor bonding adhesive layer and an adhesive layer, while exhibiting bump protection at the time of laminate and shift winding prevention at the time of manufacturing.SOLUTION: An adhesive film for bonding a semiconductor used in flip-chip bonding has a support layer (A), an adhesive layer (B) laminated on the support layer (A), and semiconductor bonding adhesive layer (C) laminated on the adhesive layer (B). The adhesive layer (B) contains a rubber-based adhesive containing a silicon-based adhesive or a styrene elastomer, and the semiconductor bonding adhesive layer (C) contains crosslinkable resin and a compound having flux activity.SELECTED DRAWING: None |
