发明名称 HIGH SPEED CONTINUOUS DRY PLATING APPARTUS
摘要 PURPOSE:To titled apparatus with which an uniform ion plating may be obtained in a low vacuum zone over a large area, by utilizing thermal evaporation principally and adding Penning discharge thereto to carry out give-and-take of electrons and generate high energy corpuscular rays.
申请公布号 JPS53109880(A) 申请公布日期 1978.09.26
申请号 JP19770024463 申请日期 1977.03.08
申请人 ULVAC CORP 发明人 HAYASHI CHIKARA
分类号 C23C14/56;C23C14/28;C23C14/32 主分类号 C23C14/56
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