Package substrates, semiconductor packages having the package substrates

摘要

Package substrates, semiconductor packages including the package substrates, and methods for fabricating the semiconductor packages are provided. A package substrate may include a core including a first surface on which a semiconductor chip is disposed and a second surface opposite the first surface. The package substrate may also include a metal pad on the second surface of the core. The metal pad may include a saline water corrosion resistant surface.

主权项

1. A semiconductor package comprising:
a core comprising a first surface and a second surface opposite the first surface, the core including a through hole penetrating through the core; a metal pad on the first surface of the core, the through hole exposing a portion of the metal pad; and a semiconductor chip on the second surface of the core, wherein the metal pad comprises a saline water corrosion resistant surface.