Floating mold tool for semicondcutor packaging

摘要

Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.

主权项

1. Tooling for molding a semiconductor device, the tooling comprising:
a clamping plate; a first cavity bar comprising a first mold half having a mold cavity formed therein for molding the semiconductor device, and wherein the first mold half comprises:
a plurality of teeth, anda space between each pair of adjacent teeth, wherein the teeth and the spaces support bending of leads of a lead frame of the semiconductor device;a second cavity bar comprising a second mold half, wherein the second mold half comprises structures to engage the teeth and spaces of the first mold half, wherein the leads are bent when the two mold halves are brought together; and an attachment mechanism that secures the first cavity bar to the clamping plate, wherein the attachment mechanism permits the first cavity bar to (i) slide in a first, horizontal direction relative to the clamping plate when the first cavity bar is being secured to the clamping plate to facilitate seating of the second mold half structure to the plurality of teeth, and in a second direction perpendicular to the first direction.