FILM-LIKE ADHESIVE COMPOSITE SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A film-like adhesive composite sheet which is provided with: a supporting sheet having a base; and a curable film-like adhesive that is provided on the supporting sheet and has a thickness of 1-50 μm. The peel strength at the interface between the supporting sheet and the film-like adhesive is 0.02-0.2 N/25 mm; and the film-like adhesive is characterized in that a laminate obtained by laminating the film-like adhesives before curing so that the total thickness of the laminate is 200 μm has an elongation at break of 450% or less.