发明名称 |
Covering for the electrical insulation of metal substrates and process for the production thereof |
摘要 |
An electrically insulating covering for a metal substrate surface comprises a thin polyimide layer which is distinguished by its good insulation capacity, readily adheres and can easily be applied. A process for applying the polyimide layer comprises the process steps of spin-on deposition of acid-modified polyamide as a precursor of polyimide, drying of the polyimide layer and subsequently imidisation of the dried polyamide layer.
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申请公布号 |
DE3429588(A1) |
申请公布日期 |
1986.02.13 |
申请号 |
DE19843429588 |
申请日期 |
1984.08.10 |
申请人 |
ENDRESS U. HAUSER GMBH U.CO |
发明人 |
HEGNER,FRANK,DR. |
分类号 |
H01B3/30;H05K1/05;(IPC1-7):H05K3/28 |
主分类号 |
H01B3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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