发明名称 |
Semiconductor-metal device comprising a Schottky junction and process for its production |
摘要 |
A semiconductor-metal device according to which an electrode 22 is formed on a semiconductor substrate 20 to form a Schottky junction between the two, and the electrode comprises an oxide film 223 which has a first thickness on its upper surface and a nonoxidised portion which has a second thickness starting at the Schottky junction. A process for producing a semiconductor-metal device according to which a conductive layer formed on a semiconductor substrate is oxidised in a gas containing oxygen and a coverless reheating of the semiconductor substrate supporting the oxidised conductive layer is conducted in an atmosphere containing arsenic. <IMAGE>
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申请公布号 |
FR2625841(A1) |
申请公布日期 |
1989.07.13 |
申请号 |
FR19890000174 |
申请日期 |
1989.01.09 |
申请人 |
TOSHIBA KK |
发明人 |
KAZUYA NISHIHORI;TOMOTOSHI INOWE;KENICHI TOMITA;HITOSHI MIKAMI;MASAMI NAGAOKA;NAOTAKE UCHITOMI |
分类号 |
H01L29/812;H01L21/338;H01L29/47;H01L29/872 |
主分类号 |
H01L29/812 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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