| 摘要 |
PURPOSE:To eliminate conductor cut or its deformation and improve the yield without placing an internal conductor into the projected surface of knockout part which is subjected to a load when a molding is released from a mold for resin seal after sealing it with resin. CONSTITUTION:A semiconductor pellet 7 mounted on a pad 8 and an assembly body where an internal lead 9a is connected to a conductor 10 are filled into a mold for sealing it with a heated resin and it is cured by injecting a softened thermoset resin 11. Then, since the conductor 10 connecting the semiconductor pellet 7 and the internal lead 9a is placed at an area other than the projected surface of knockout parts 12a-12c, the position of the conductor 10 may be at an area other than the projected surface of the knockout parts 12a-12c. However, when for example sealing it with resin to a thickness of 2mm using a thermoset epoxy resin, it is preferable to keep it away from the projected surface by 1mm or more. Thus, since the conductor is not placed within the projected surface of the knockout part, neither breaking nor deformation of conductor results when the molding is released from a mold for sealing it with resin to improve the yield.
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