| 摘要 |
A thermosetting resin composition comprising at least a cycloaliphatic ether oligomer represented by the general formula (I): <CHEM> wherein m and n are each 0 to 30 and 2<m+n</=30, and a p-hydroxylstyrene polymer or copolymer represented by the general formula (III): <CHEM> wherein y is H, NH2, SO3H, Br or Cl and r is 5 to 300. The thermosetting resin composition is suitable for coating and sealing semiconductor device and improves heat resistance, humidity resistance and migration resistance of the semiconductor device coated and sealed thereby. |
