| 摘要 |
PCT No. PCT/DE95/00137 Sec. 371 Date Aug. 13, 1996 Sec. 102(e) Date Aug. 13, 1996 PCT Filed Feb. 2, 1995 PCT Pub. No. WO95/22840 PCT Pub. Date Aug. 24, 1995Substrates (11, 12) each of which having components with contacts (13, 14) are arranged one above the other in a stack in order to produce a three-dimensional circuit arrangement. Metal surfaces (20) are applied onto that main surface (15) of at least one of the substrates (11) which is adjacent to the other substrate, which metal surfaces (20) are soldered to the adjacent main surface (17) of the other substrate (12) in order to produce the mechanical joint between the two substrates (11, 12). The components can be tested before the application of further substrates, and substrates having faulty components are removed by grinding away into the metal surfaces (20). |
