| 摘要 |
PURPOSE: To make it possible to provide a semiconductor chip at a desired position in sealing resin and to mass-produce die-padless resin-sealed semiconductor devices easily and economically. CONSTITUTION: This invention concerns a manufacturing method for resin-sealed semiconductor devices, and a semiconductor chip and inner leads are connected with bonding wires, and these are sealed with sealing resin into a united body. First of all, position adjustment between a semiconductor chip l and lead frames having stationary leads 21 and inner leads is performed before sealing with resin into a united body. Following this. wedgelike jigs 52 are wedged into holes 22 formed in the stationary leads 21 of the lead frames, and the holes 22 are extended and the stationary leads 21 are deformed. And the semiconductor chip is interposed between the deformed statinary leads 21, and fixed. It does not matter if the jig wedging holes are formed in the inner leads or outside frames of the lead frames, in stead of the stationary leads. |
