发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. usable as an aq. soln. and capable of forming a tough transparent hardened film by slight exposure and to obtain a colored photosensitive resin compsn. SOLUTION: This photosensitive resin compsn. consists of a water-soluble copolymerized resin obtd. by copolymerizing 2hydroxyethyl (meth)acrylate with methoxymethyl (meth)acrylamide and (meth)acrylamide and a water-soluble diazo resin and it is obtd. by carrying out the copolymn. in an aq. sol of tin oxide and mixing the resultant resin with the water-soluble diazo resin. This colored photosensitive resin compsn. consists of a water-soluble copolymerized resin obtd. by copolymerizing 2-hydroxyethyl (meth)acrylate with methoxymethyl (meth)acrylamide and (meth)acrylamide, a water-soluble diazo resin and a pigment and it is obtd. by carrying out the copolymn. in an aq. sol of tin oxide and mixing the resultant resin with the water-soluble diazo resin and the pigment.</p>
申请公布号 JPH09211854(A) 申请公布日期 1997.08.15
申请号 JP19960016496 申请日期 1996.02.01
申请人 SEKISUI FINECHEM CO LTD 发明人 MORI HIROFUMI;KAMEI YOICHIRO
分类号 G03F7/004;C08F2/44;C08L33/00;C08L33/24;G02B5/20;G03F7/021;G03F7/033;(IPC1-7):G03F7/021 主分类号 G03F7/004
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