SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

A semiconductor integrated circuit device such that the problems of performance deterioration and malfunction of the circuit are solved. As shown in the figure, guard bands (6a and 6b) surrounding either an analog section (1) or digital section are formed in the front of an integrated circuit substrate, and the conductor sections (4a and 4b) of the analog and digital sections (1 and 2) are provided on the back of the circuit substrate. The conductor section (4b) of the digital section (2) is set at a virtual grounding potential bythe feeding backing of an amplifier circuit (7a). As a result, substrate noise produced from the digital section (2) is offset and the influence of the digital noise transmitted to the analog section (1) is reduced.