| 摘要 |
<p>The present invention relates to a process for preparing a high molecular weight epoxy resin which has a weight average molecular weight value of more than 40,000 and an epoxy equivalent weight of less than 10,000 g/eq. This high molecular weight epoxy is prepared by a reaction of a divalent epoxy resin with a bisphenol compound in the presence of a catalyst and a solvent characterized in utilizing 1.10 to 1.03/1 of molar ratio of epoxy group/phenolic hydroxyl group. The epoxy resin obtained by the present invention can be used in various applications such as coatings, electrical insulation, and adhesives, and especially has excellent properties for the waterborne can coatings application.</p> |
