| 摘要 |
A method for making a microelectronic package includes providing first and second microelectronic elements having electrically conductive parts, juxtaposing the first and second microelectronic elements with one another, bonding electrically conductive parts of the microelectronic elements together to form electrical interconnection, providing a resilient element having one or more tacky surface regions in contact with one or more liners separately from the first and second microelectronic elements, assembling the resilient element with at least one of said microelectronic elements, and removing the resilient element from the one or more liners prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps. In other embodiments, the method of making a microelectronic package includes providing a resilient element having one or more tacky surface regions separately from the first and second microelectronic elements, and assembling the resilient elements with at least one of the microelectronic elements prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps, wherein the step of assembling the resilient element with at least one of the microelectronic elements is performed less than 24 hours prior to the bonding step. In certain embodiments the resilient elements include an adhesive at one or more tacky surface regions thereof. In other embodiments, the resilient elements include partially-cured surfaces at the one or more tacky surface regions. Also disclosed is a method of fabricating a resilient element of a microelectronic package having one or more tacky surface regions. The method includes the steps of providing a first liner, providing a mass of a curable material on the liner, and curing the mass so that a region of the mass in contact with the liner is tacky.
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