| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve heat-resistant and shock resistant characteristics, by sealing and filling a member electrically connecting a semiconductor chip and a circuit wiring in a chip mounting section with a sealing and filling agent having specific temperature and complex elastic modulus. SOLUTION: A semiconductor chip 1 is bonded with adhesives 3 in a shape that the semiconductor chip 1 is faced oppositely to a semiconductor chip mounting section (a chip carrier) 2. Circuit wirings 4 are formed onto a face oppositely faced to the semiconductor chip 1 in the semiconductor chip mounting section 2, and the circuit wiring 4 and the semiconductor chip 1 are connected electrically by leads 5. Parts or the whole of the leads 5 are sealed or filled with a sealing and filling agent 6. A complex elastic modules in at least one of the characteristic at the temperature of -65 deg.C and a cut-off frequency of 10 Hz for the sealing and the filling functions in the agent 6 must be kept in 1×10<9> dyne/cm<2> or less at that time, particularly it is preferable that the complex elastic modulus is kept within a range of 1×10 dyne/cm<2> or 1×10<3> dyne/cm<2> . Accordingly, excellent heat resistant and shock resistant characteristic can be obtained.</p> |
