| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board exhibiting a superior connection reliability and repairability. SOLUTION: Phenoxy resin and acrylic rubber are dissolved to form a solution. Liquid epoxy containing a micro-encapsulated potential hardener is added to the solution. Furthermore, conductive particles on the surface of polystyrene base nucleus of which an Au layer is formed are dispersed to form a solvent for film coating. A provisional substrate of stainless plate is coated with planting resist except at the points for forming electrodes. Copper electroplating is performed to form the electrodes. Epoxy resin prepreg with glass substrate is pressed against the surface of the electrodes to embed the copper electrodes in an insulating layer. The conductive provisional substrate is removed to obtain a printed board in which a Cu circuit is embedded. Then chips with gold bumps are connected to the printed board, in which Cu circuit is embedded with an adhesive film. |
