Antireflective coating used in the fabrication of microcircuit structures in 0.18 micron and smaller technologies
摘要
An anti-reflective coating for use in microcircuit fabrication and specifically using ultraviolet photolithographic processes. A three layered anti-reflective coating is used to enhance metallization etching in the construction of microcircuits. The coating features a titanium nitride anti-reflective layer sandwiched between two titanium metal layers. The upper titanium layer protects subsequently applied deep ultraviolet photoresists from the deleterious effects of the titanium nitride anti-reflective layer. The unique character of the three layer anti-reflective coating allows the use of an efficient single chamber fabrication process to form the three layer coating.
申请公布号
US6165855(A)
申请公布日期
2000.12.26
申请号
US19980205068
申请日期
1998.12.04
申请人
ADVANCED MICRO DEVICES, INC.
发明人
BESSER, PAUL R.;SINGH, BHANWAR;ERB, DARRELL M.;CHEN, SUSAN H.;MORALES, CARMEN