| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate and method for evaluating, by which the solder wettability of a connection electrode of an electronic component with a solder ball as a connection electrode, e.g. such as BGA can be evaluated readily under a safe environment and with high reliability. SOLUTION: An evaluating substrate 10 is provided with wettability evaluating electrodes 11, each being made of a metal film which is formed on an end side on one surface of a base material 13. Each evaluating electrode 11 comprises a circular part 11a in one side and a strip part 11b extending from the circuit part 11a to the end edge side of the base material 13. The circular part 11a is used as a melting/fixing electrode for melting and fixing a solder ball of a BGA component (component electrode). For evaluating wettability, after a component is mounted on the evaluation substrate 10 (the solder ball is abutted on the circular part 11a), the solder ball is melted and the wet spread of the solder onto the evaluating electrode is observed visually, so that, wettability of the solder ball can be evaluated.
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