| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which is not restricted by stress due to the difference in coefficient of thermal expansion between a heat spreader and a semiconductor chip, eliminates the need to consider the storage stability of an adhesive and the uniform dispersibility of a filler, eliminates the need for a tool for thermocompression bonding and avoids the resulting damage to the semiconductor chip, and shortens the processing time. SOLUTION: This semiconductor device with the heat spreader has the semiconductor chip 2 mounted on a multi-layered wiring board 1 across an electrode pad 5 and insulating resin 4. The top of the side of the semiconductor chip 2 on the substrate 1 is sealed with an insulating resin layer 6 and a copper paste film 7 which comes into contact with an exposed surface of the top surface of the semiconductor chip 2 is formed. The copper paste film 7 functions as the heat spreader. |
