| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method wherein semiconductor elements can be subjected to thermo-compression bonding by using a simple manufacturing process in a short time. SOLUTION: Semiconductor elements 9, 30 are heated and pressed on a surface of a wiring board wherein thermoplastic resin layers 2a, 2b, 22 and connection terminals with the semiconductor elements 9, 30 are formed on the surface, and electrically connected with the connection terminals. Surfaces of a substrate side of the semiconductor elements 9, 30 are bonded and sealed by using the thermoplastic resin layers 2a, 2b, 22. |
