| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer grinding device capable of moving a holding plate in leaving and entering directions with respect to the recess of an outer frame member smoothly, by keeping the matching state of the centroid of a wafer and the center of rotation when moving the wafer held by a holding plate for grinding it. SOLUTION: The device is provided with the outer frame member 24 where a recessed part 26 for housing a holding plate 10 is formed so that the holding surface 11 of the plate 10 holding a wafer W may oppose the grinding surface of a surface plate, an elastic sheet 38 reinforced by a fabric reinforcing material for hanging the plate 10 biased in the direction of housing it within the part 26, a space part 50 formed between the sheet 38 and the bottom surface of the part 26 to store compressed air for pushing the plate 10 in the direction of the surface plate against the biasing force of the sheet 38, and a plurality of spherical bodies 9 arranged between the outer peripheral surface 10a of the plate 10 and the inner peripheral surface 24a of the part 26 so as to be in point contact with both of the surfaces of the surface 10a and the surface 24a simultaneously. |
