发明名称 |
Wirefilm bonding for electronic component interconnection |
摘要 |
A system (30) is provided for interconnecting a first component (10) having multiple first bonding sites (16) and a second component (12) having multiple second bonding sites (18). The system (30) includes a leadframe (40) coupled to the first component (10) and the second component (12) that advances from a first position (50) to a second position (52). A film tape carrier (32) advances a wirefilm (20) removably coupled to the film tape carrier (32) into the first position (50). The wirefilm (20) includes a substantially planar film (22) and multiple wire strands (14), each wire strand (14) having a first end (24) that contacts a first bonding site (16) and a second end (26) that contacts a second bonding site (18). A film attach tool (62) contacts the first component (10) and the second component (12) with the wirefilm (20) at the first position (50) to interconnect the first component (10) and the second component (12).
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申请公布号 |
US6857459(B1) |
申请公布日期 |
2005.02.22 |
申请号 |
US19990395254 |
申请日期 |
1999.09.13 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MADRID RUBEN P. |
分类号 |
H01L23/495;(IPC1-7):B32B31/20 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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