| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device which mounts an electronic component on a flexible base material, is improved in efficiency by mounting many electronic components on a plurality of patterns on the flexible substrate at the same time, and also improved in a yield by preventing wrinkling. <P>SOLUTION: A mounting stage 13 has a plurality of projections 22 made to correspond to positions of respective IC chips 16 mounted on a plurality of antennas 23 formed on the flexible base material sheet 15. The stage partially sucks and fixes the base material sheet 15 through a designated number of air vents 22A formed in the projections 22 when the base material sheet 15 on which the IC chips 16 are mounted is conveyed. The IC chip is heated and pressed to the antennas 23 and the IC chips 16 on the base material sheet 15 having a mount attachment group 12 sucked to and fixed on the projections 22 to electrically connect the IC chips 16 to the antennas 23. <P>COPYRIGHT: (C)2007,JPO&INPIT |
