发明名称 Modular semiconductor package testing contactor system
摘要 An interconnect mechanism for providing electrical interconnection between a device under test and a tester includes a base having a first side and a second side. The base defines a plurality of apertures extending from the first side to the second side. The first side of the base is configured to receive the device under test. The interconnect mechanism also includes a plurality of alignment mechanisms configured to be detachably coupled to the first side of the base. The plurality of alignment mechanisms define an area of the first side of the base to receive the device under test when the plurality of alignment mechanisms are coupled to the first side of the base. Each of the plurality of alignment mechanisms includes an adjustment mechanism for adjusting the area of the first side of the base defined by the plurality of alignment mechanisms.
申请公布号 US7189092(B2) 申请公布日期 2007.03.13
申请号 US20050177673 申请日期 2005.07.08
申请人 ANTARES CONTECH, INC. 发明人 PIATTI LAWRENCE ERCOLI
分类号 H01R13/62 主分类号 H01R13/62
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