| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip semiconductor device and a mounting method thereof capable of easily gaining a KGD and retaining the quality without being influenced by the circumferential environment. SOLUTION: In this semiconductor device, an electrode formed on the surface of a first resin sealed package having a semiconductor chip sealed therein with resin is connected to the electrode of the semiconductor chip, and a mounting area to be connected to a mounting object and a testing area for connecting a testing apparatus are provided thereon. |
