发明名称 High speed and density circular connector for board-to-board interconnection systems
摘要 A system and method for interconnecting circuit boards is disclosed. The apparatus comprises a first circuit board, having an aperture comprising a plurality of aperture conductive surfaces disposed on an inner surface of the aperture, at least one of the conductive surfaces communicatively coupled to at least one of a plurality of first circuit board traces; a second circuit board, having a plurality of second circuit board traces; and a connector disposed at least partially through the aperture and between the first circuit board and the second circuit board, the connector having a plurality of conductive signal conductors, each having a first portion disposed at the periphery of the connector and adjacent to the aperture conductive surfaces and a second portion communicatively coupled with the second circuit board traces.
申请公布号 US2002016092(A1) 申请公布日期 2002.02.07
申请号 US20010921152 申请日期 2001.08.02
申请人 DIBENE JOSEPH T. 发明人 DIBENE JOSEPH T.
分类号 G06F1/18;H01L23/427;H01R4/64;H01R12/16;H05K1/02;H05K1/14;H05K3/30;H05K3/36;H05K7/10;H05K7/20;(IPC1-7):H05K1/00 主分类号 G06F1/18
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