发明名称 |
Semiconductor device and a method of manufacturing the same and an electronic device |
摘要 |
A first semiconductor chip (2) is bonded and secured to a second semiconductor chip (3) with a back surface of the first semiconductor chip (2) and a circuit forming surface (3X) of the second semiconductor chip (3) facing each other, and an inner portion of a support lead (6) is bonded and secured to the circuit forming surface (3X) of the second semiconductor chip (3). Such a configuration makes it possible to provide a semiconductor with a reduced thickness.
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申请公布号 |
US2002014686(A1) |
申请公布日期 |
2002.02.07 |
申请号 |
US20010915375 |
申请日期 |
2001.07.27 |
申请人 |
HITACHI, LTD. AND HITACHI ULSI SYSTEMS CO., LTD. |
发明人 |
KANEMOTO KOUICHI;MASUDA MASACHIKA;WADA TAMAKI;SUGIYAMA MICHIAKI;KIMURA MIKAKO |
分类号 |
H01L21/56;H01L23/495;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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