| 摘要 |
PROBLEM TO BE SOLVED: To provide a speaker which enables an equipment casing to be made thin without impairing frequency characteristics. SOLUTION: Grooves 16 each of which extends from an opening portion of a corresponding back sound hole 15 to an edge of the speaker back are provided on a speaker back, and each groove forms a sound path 20 for releasing sound from a speaker lateral side that can not be released from the back sound hole 15 to a speaker back side because of a circuit board 19 or the like being contents of the equipment casing covering the speaker back, even when the circuit board 19 or the like is attached in such a manner that the speaker back is covered with the circuit board 19 or the like, therefore frequency characteristics can be obtained, the frequency characteristics being approximately equal with a case where such attaching is performed that the speaker back is not covered with the circuit board 19 or the like. COPYRIGHT: (C)2008,JPO&INPIT
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