发明名称 Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern using the photoresist composition
摘要 In a photosensitive resin, a photoresist composition including the photosensitive resin and a method of forming a photoresist pattern using the photoresist composition, the photosensitive resin includes a hydrophobic terminal group having at least five carbon atoms and a blocking group. The photosensitive resin has a weight average molecular weight of from about 6,000 up to about 9,500. The photoresist composition including the photosensitive resin may form a photoresist pattern having a reduced line edge roughness and a fine line width with accuracy.
申请公布号 US7326519(B2) 申请公布日期 2008.02.05
申请号 US20060350559 申请日期 2006.02.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HAN SEOK;YOON SANGWOONG;KIM YOUNG-HO
分类号 G03C1/76;G03C1/492;G03C1/494;G03C5/00 主分类号 G03C1/76
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