发明名称 |
Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern using the photoresist composition |
摘要 |
In a photosensitive resin, a photoresist composition including the photosensitive resin and a method of forming a photoresist pattern using the photoresist composition, the photosensitive resin includes a hydrophobic terminal group having at least five carbon atoms and a blocking group. The photosensitive resin has a weight average molecular weight of from about 6,000 up to about 9,500. The photoresist composition including the photosensitive resin may form a photoresist pattern having a reduced line edge roughness and a fine line width with accuracy.
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申请公布号 |
US7326519(B2) |
申请公布日期 |
2008.02.05 |
申请号 |
US20060350559 |
申请日期 |
2006.02.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HAN SEOK;YOON SANGWOONG;KIM YOUNG-HO |
分类号 |
G03C1/76;G03C1/492;G03C1/494;G03C5/00 |
主分类号 |
G03C1/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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