| 摘要 |
PROBLEM TO BE SOLVED: To avoid the addition of a process for plating resist formation and resist removal generated since depths are different, and thereby to avoid extension of lead time and increase of costs when filling copper plating in via holes of the different depths. SOLUTION: In plating E of filling the copper plating inside the via holes, by designing the single opening area of the via hole to be wider for a shallow via hole than for a deep via hole, the via holes of the different depths are filled flatly. As needed, the opening area of the deep via hole is made wider on the opening side than on the via hole bottom side, and the via holes of a narrow area are arranged in parallel for the deep via holes at a part requiring a connection area. COPYRIGHT: (C)2008,JPO&INPIT
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