| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for a flexible printed wiring board which is excellent in adherence property and close contact property of a conductor forming a circuit with a polyimide film, is excellent in reliability without impairing characteristics such as dielectric characteristic, humidity resistance, and heat resistance or the like of a polyimide film, and enables fine pattern machining of the flexible printed wiring board, and its manufacturing method. SOLUTION: The laminate for the flexible printed wiring board is the laminate containing the polyimide film used for the flexible printed wiring board, where an electron beam processing is performed on at least one side surface of the polyimide film, a nitrogen-containing group vinyl compound is graft-polymerized on the surface processed with the electron beam, and a nonelectrolytic plating layer is formed on the surface of the graft-polymerization processed polyimide film through a catalyst containing a noble metal compound. The electron-beam processing is previously performed on the polyimide film surface so as to be activated. COPYRIGHT: (C)2009,JPO&INPIT |
