| 发明名称 | Substrate conveying method, recording medium in which program is recorded for causing substrate conveying method to be executed, and substrate conveyor | ||
| 摘要 | A substrate conveying method conveying a layered body having first and second substrates stacked with a spacer member provided between their respective bottom surfaces facing each other includes receiving the first substrate by holding the first substrate from below its bottom surface using a first holding mechanism provided on a side of a first fork provided above a second fork, and turning the first fork upside down and placing the received first substrate on the second fork; receiving the spacer member held in a substrate holding part by holding the spacer member from above using a second holding mechanism provided on the same side of the first fork as the first holding mechanism, and placing the received spacer member on the first substrate; and holding the second substrate from above its top surface using the first holding mechanism, and placing the received second substrate on the spacer member. | ||
| 申请公布号 | US9368384(B2) | 申请公布日期 | 2016.06.14 |
| 申请号 | US201213410368 | 申请日期 | 2012.03.02 |
| 申请人 | Tokyo Electron Limited | 发明人 | Yamagishi Daisuke;Oyama Katsuhiko;Sato Masataka;Takeuchi Yasushi |
| 分类号 | B65H1/00;H01L21/677;H01L21/67;H01L21/673;H01L21/687;C23C16/458 | 主分类号 | B65H1/00 |
| 代理机构 | IPUSA, PLLC | 代理人 | IPUSA, PLLC |
| 主权项 | 1. A substrate conveying method conveying a layered body having a first substrate and a second substrate stacked in layers with a spacer member provided between respective bottom surfaces thereof facing each other, the substrate conveying method comprising: receiving the first substrate accommodated in an accommodating part by holding the first substrate from below the bottom surface thereof using a first holding mechanism provided on a side of a first fork provided on a turnable base so as to be positioned above a second fork provided on the turnable base, and turning the first fork upside down and placing the received first substrate on the second fork; receiving the spacer member held in a substrate holding part by holding the spacer member from above the spacer member using a second holding mechanism provided on the same side of the first fork as the first holding mechanism, and placing the received spacer member on the first substrate placed on the second fork; and holding the second substrate accommodated in the accommodating part from above a top surface thereof using the first holding mechanism, and placing the received second substrate on the spacer member placed over the second fork. | ||
| 地址 | Tokyo JP | ||