发明名称 Methods for forming doped silicon oxide thin films
摘要 The present disclosure relates to the deposition of dopant films, such as doped silicon oxide films, by atomic layer deposition processes. In some embodiments, a substrate in a reaction space is contacted with pulses of a silicon precursor and a dopant precursor, such that the silicon precursor and dopant precursor adsorb on the substrate surface. Oxygen plasma is used to convert the adsorbed silicon precursor and dopant precursor to doped silicon oxide.
申请公布号 US9368352(B2) 申请公布日期 2016.06.14
申请号 US201414501653 申请日期 2014.09.30
申请人 ASM INTERNATIONAL N.V. 发明人 Takamure Noboru;Fukazawa Atsuki;Fukuda Hideaki;Niskanen Antti;Haukka Suvi;Nakano Ryu;Namba Kunitoshi
分类号 H01L21/22;H01L21/225;H01L21/02;H01L21/324 主分类号 H01L21/22
代理机构 Knobbe, Martens, Olson & Bear LLP 代理人 Knobbe, Martens, Olson & Bear LLP
主权项 1. A method for depositing doped silicon oxide on a substrate by an atomic layer deposition (ALD) process, the ALD process comprising at least one first deposition cycle comprising: exposing the substrate to a silicon precursor; exposing the substrate to a dopant precursor; and subsequently moving the substrate such that it is exposed to a reactive species and a doped silicon oxide is formed on the substrate.
地址 NL